![]() ![]() ![]() ![]() However, traditional printing processes require a flat surface and are incapable of achieving patterning onto 3D objects. Printing has drawn a lot of attention as a means of low per‐unit cost and high throughput patterning of graphene inks for scaled‐up thin‐form factor device manufacturing. We demonstrate a new design interface specifically for designing conformal interconnects, which allows designers to draw conductive patterns in 3D and export pre-distorted sheet models ready to be 3D printed. We characterise the behaviour of the vacuum-formed 3D printed sheet, analyse the electrical performance of 3D printed traces after vacuum-forming, and showcase a range of examples constructed using the technique. 3D printing the sheet material allows embedding conductive traces within thin layers of the substrate, which can be vacuum-formed but remain conductive and insulated. While 3D printing a mold for vacuum-forming has been explored by many, utilising 3D printing to construct sheet materials has remains unexplored. In this paper, we present a new hybrid method for constructing thin, rigid and free-form interconnected surfaces via fused deposition modelling (FDM) 3D printing and vacuum-forming. Hybrid additive manufacturing techniques like thermoforming are becoming popular for prototyping freeform electronics given its design flexibility, speed and cost-effectiveness. Integrating advanced functionality, which may include sensing, computation and communication, within thin structures is desirable for various next-generation interactive devices. Vacuum-forming is ubiquitous in packaging and casing products in industry spanning fast moving consumer goods to connected devices. ![]() Vacuum-forming is a common manufacturing technique for constructing thin plastic shell products by pressing heated plastic sheets onto a mold using atmospheric pressure. ![]()
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